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plasma technology GmbH Dipl.-Ing. (FH) Joerg Eisenlohr Etzwiesenstr. 33 D-72108 Rottenburg a.N. GERMANY fon: +49 (0) 74 57 / 73 15 - 39 fax: +49 (0) 74 57 / 73 15 - 44 E-Mail: info@plasmatechnology.de
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Plasma activation of plastics prior to adhesive bonding, printing, varnishing…
Organic contaminations on the metal surface react with the supplied process gas. The reaction gas continuously is sucked off. The surface is cleaned.
Plasma reduction Applications:
The metal oxide chemically reacts with the process gas. The deposited oxygen is withdrawn from the surface. As a process gas, pure hydrogen or a mixture with argon is used.
In the plasma structuring / plasma etching process gases are used which may convert the material to be etched into the gas phase (for example etching of silicon with fluorine containing gases). Raw gas is supplied and ionized. The resulting reaction gas is sucked off. Thus, a continuous demolition is reached. Areas can be protected by means of an etching layer (such as chromium) being resistant against the used process gas. Thus, a surface can be structured specifically.
Plasma polymerisation as a coating of surfaces , protective coatings, hydrophobic coatings All conceivable areas
Sponge with a hydrophobic plasma coating
Not only cleaning effects can be obtained with plasma, but it also is possible to coat construction units. Thus, in the recipients monomers are introduced which then polymerize under the influence of plasma. The process technology substantially is more complex on comparison to activation and degreasing. For example, barrier layers in fuel tanks, scratch-proof layers on headlights, layers similar to PTFE, hydrophobic layers can be manufactured. All the layers are extremely thin, being within the range of one micrometer. The adhesion at the surface is very good.
Plasma sterilization
Plasma bond pretreatment
Plasma boundary lubrication, construction units are provided with coatings
electronics industry
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